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Advanced Manufacturing Technologies (AMT)

By staying at the forefront of technology with regard to manufacturing and test processes, production equipment and line automation, the AMT team aims to minimize non-recurring expenses for our customers without compromising on product quality and productivity. The team conducts in-depth research into our customers' requirements, and ensures that the most efficient practices and technologies are employed. Additionally, the AMT team also performs DFM / DFT analysis on all products prior to the manufacturing process.

Among the technologies employed are:

  • direct chip attach (DCA) / wire-bonding
  • 3-D soldering
  • PCA / product testing
  • 0201
  • 16 mils quad flak pak (QFP)
  • flip chip (180-micron pitch size)
  • lead-free processing (RoHS compliant)
  • 160x80 mils ultra ball-grid arrays (BGAs)
  • 1000 I/Os super-high BGAs
  • >1600I/Os ceramic column-grid array (CCGA)
  • paste-in-hole (PIH) extrusion soldering
  • nitrogen re-flow