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Advanced Manufacturing Technologies (AMT)
By staying at the forefront of technology with regard to manufacturing
and test processes, production equipment and line automation, the AMT
team aims to minimize non-recurring expenses for our customers without
compromising on product quality and productivity. The team conducts
in-depth research into our customers' requirements, and ensures that
the most efficient practices and technologies are employed. Additionally,
the AMT team also performs DFM / DFT analysis on all products prior
to the manufacturing process.
Among the technologies employed are:
- direct chip attach (DCA) / wire-bonding
- 3-D soldering
- PCA / product testing
- 0201
- 16 mils quad flak pak (QFP)
- flip chip (180-micron pitch size)
- lead-free processing (RoHS compliant)
- 160x80 mils ultra ball-grid arrays (BGAs)
- 1000 I/Os super-high BGAs
- >1600I/Os ceramic column-grid array (CCGA)
- paste-in-hole (PIH) extrusion soldering
- nitrogen re-flow
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